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W541C261 BZ5221 FDMD8630 MAX232 TK61023 4N06L 222M35 IDM25PH5
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  power f-mos fets 2sk758 2SK2324 (tentative) silicon n-channel power f-mos n features l avalanche energy capability guaranteed l high-speed switching l low on-resistance l no secondary breakdown n applications l non-contact relay l solenoid drive l motor drive l control equipment l switching mode regulator n absolute maximum ratings (tc = 25?c) parameter drain-source breakdown voltage gate-source voltage drain current dc pulse avalanche energy capability allowable power t c = 25?c dissipation ta= 25?c channel temperature storage temperature symbol v dss v gss i d i dp eas * p d t ch t stg rating 600 30 2 4 10 2 40 150 C55 to +150 unit v v a a mj w ?c ?c n electrical characteristics (tc = 25?c) parameter drain-source cut-off current gate-source leakage current drain-source breakdown voltage gate threshold voltage drain-source on-resistance forward transadmittance diode forward voltage input capacitance output capacitance feedback capacitance turn-on time (delay time) rise time fall time turn-off time (delay time) channel-case heat resistance channel-atmosphere heat resistance symbol i dss i gss v dss v th r ds(on) | y fs | v dsf c iss c oss c rss t d(on) t r t f t d(off) r th(ch-c) r th(ch-a) condition v ds = 480v, v gs = 0 v gs = 30v, v ds = 0 i d =1ma, v gs = 0 v ds = 25v, i d =1ma v gs =10v, i d =1a v ds = 25v, i d =1a i dr = 2a, v gs = 0 v ds = 20v, v gs = 0, f=1mhz v dd = 200v, i d =1a v gs =10v, r l = 200 w min 600 2 0.5 typ 4.9 0.85 260 35 10 15 25 35 35 max 100 1 5 6 C1.6 3.125 62.5 unit a a v v w s v pf pf pf ns ns ns ns ?c/w ?c/w unit : mm 1 : gate 2 : drain 3 : source to-220e package * l= 5mh, i l = 2a, 1 pulse 9.9 0.3 23 1 4.6 0.2 2.9 0.2 2.6 0.1 2.54 0.2 0.75 0.1 1.2 0.15 5.08 0.4 15.0 0.3 13.7 +0.5 -0.2 ?.2 0.1 3.0 0.2 8.0 0.2 4.1 0.2 solder dip 1.45 0.15 0.7 0.1 7? free datasheet http:///
request for your special attention and precautions in using the technical information and s e m iconductors described in this book ( 1 ) i f any o f t h e p r o d u cts o r t echnical i n f o r m ation d escribed i n t h i s b o o k i s t o b e exported o r p r o v i d ed t o n o n - r esidents, t h e l aws and r egulations of the exporting country, especially, those with regard to security export control, must be observed. ( 2 ) t h e t echnical i n f o r m ation d escribed i n t h i s b o o k i s i n t ended o n l y t o show t h e m ain characteristics and application circuit examples o f t h e p r o d u cts, and n o l i cense i s g r anted u n d er any i n t ellectual p r o p erty r i g h t o r o t h er r i g h t o wned b y o u r company o r any o t h er company. t h erefore, n o r esponsibility i s assumed b y o u r company as t o t h e i n f r i n g ement u p o n any such r i g h t o wned b y any o t h er company which may arise as a result of the use of technical information described in this book. ( 3 ) t h e p r o d u cts d escribed i n t h i s b o o k are i n t ended t o b e u sed f o r standard applications o r g eneral electronic equipment ( such as o f f i ce equipment, communications equipment, measuring instruments and household appliances). consult our sales staff in advance for information on the following applications: ? s p ecial applications ( such as f o r airplanes, aerospace, automobiles, t r affic control equipment, combustion equipment, l i f e support systems and safety d evices) i n which exceptional q u ality and r eliability are r equired, o r i f t h e f ailure o r m alfunction o f t h e p r o d- u cts may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. ( 4 ) t h e p r o d u cts and p r o d u ct specifications d escribed i n t h i s b o o k are subject t o change without n o t i ce f o r m o d i f i cation and/or i m- p r o v ement. at t h e f i n al stage o f y o u r d esign, p u r chasing, o r u se o f t h e p r o d u cts, t h erefore, ask f o r t h e m o st u p - t o - d ate p r o d u ct s t andards in advance to make sure that the latest specifications satisfy your requirements. ( 5 ) when d esigning y o u r equipment, comply with t h e r ange o f absolute m aximum r ating and t h e g u aranteed o p erating conditions ( o p erating p o wer supply v o l t age and o p erating environment etc.). e specially, p l ease b e careful n o t t o exceed t h e r ange o f absolute m aximum r ating o n t h e t r ansient state, such as p o wer-on, p o wer-off and m o d e-switching. otherwise, we will n o t b e l i able f o r any d efect which may arise later in your equipment. e v en when t h e p r o d u cts are u sed within t h e g u aranteed v alues, t ake i n t o t h e consideration o f i n cidence o f b r eak d o wn and f ailure m o d e, p o ssible t o o ccur t o semiconductor p r o d u cts. measures o n t h e systems such as r edundant d esign, arresting t h e spread o f f i r e o r p r eventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. ( 6 ) comply with t h e i n structions f o r u se i n o r d er t o p r event b r eakdown and characteristics change d u e t o external f actors ( e s d, e os, t h ermal stress and m echanical stress) at t h e t i m e o f h andling, m o u n t i n g o r at customer's p r o cess. when u sing p r o d u cts f o r which d amp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. ( 7 ) t h i s b o o k m ay b e n o t r eprinted o r r eproduced whether wholly o r p artially, without t h e p r i o r written p ermission o f matsushita e l ectric industrial co., ltd.


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